Ever increasing data rates, higher channel counts, smaller form factors and closer line proximity continue to make package designs ever more challenging. IX-CAD has the Know-How and the simulation tools integrated in Agilent’s ADS to design and verify the RF performance of the package prior to manufacturing.
In many cases optoelectronic packages are hermetic packages. Our partner for hermetic packages is SCHOTT Electronic Packaging.
SCHOTT Electronic Packaging and ix-cad Collaboration
SCHOTT and ix-cad have shared their vision regarding the need of cost effective, hermetic sealed packages for very high speed Fiber Optics components.
This collaboration leverages SCHOTT’s expertise in developing and manufacturing reliable, hermetic packages and combines that expertise with the advanced circuit and EM simulation capability from IX-CAD. SCHOTT and IX-CAD have defined a common design flow to achieve highest quality within short development time. The first 10Gbit/s TO46 header in the world and joint patents are results of this partnership.
The partnership offers customers the opportunity to design an entire customized package solution from the opto-electronic converter to the host board.